4 December 2024

UNITEMP RTP-100 Rapid Thermal Processing System is a furnace used for various purposes such as improving the mechanical properties of metals, crystallizing semiconductors, and repairing defects. This system allows materials to be rapidly heated to high temperatures in a vacuum environment or under a desired gas atmosphere. After processing, materials can be cooled slowly and in a controlled manner.

Key Features:

• Used for various semiconductor processes, annealing, quality control, rapid thermal treatments, and post-implantation annealing.
• Fast heating with 18 infrared lamps (20 kW).
• Maximum temperature: 1200 °C.
• Furnace size: 504 x 504 (700) x 570 mm.
• Chamber height: 18 mm.
• Maximum sample capacity: 4 inches.
• Processing chamber made of aluminum and quartz glass.
• 50-program SPS process controller.
• External pump system capable of achieving vacuum (down to 10⁻³ hPa).
• 7″ touch panel with SIMATIC® controller.
• Process gas line with Mass Flow Controller for nitrogen.
• Ensures excellent temperature distribution and uniformity (≤ ± 1.5%).
• Programmable temperature profiles:
  • Heating rate: Up to 150 K/s, optionally 200 K/s.
  • Cooling rate: From 1200 °C to 400 °C at 200 K/min, and from 400 °C to 100 °C at 30 K/min.