4 December 2024

UNITEMP RTP-100 Rapid Thermal Processing System is a furnace used for various purposes such as improving the mechanical properties of metals, crystallizing semiconductors, and repairing defects. This system allows materials to be rapidly heated to high temperatures in a vacuum environment or under a desired gas atmosphere. After processing, materials can be cooled slowly and in a controlled manner.

• Used for various semiconductor processes, annealing, quality control, rapid thermal treatments, and post-implantation annealing.
• Fast heating with 18 infrared lamps (20 kW)
• Maximum temperature 1200 °C
• Oven size: 504 x 504 (700) x 570 mm
• Chamber height 18 mm
• Maximum 4 inch sample capacity
• Process chamber made of aluminum chamber and quartz glass
• SPS process controller with 50 programs
• External pump system capable of vacuum (up to 10⁻³ hPa)
• SIMATIC® controller with 7″ touch panel
• Process gas line with Mass Flow Controller for Nitrogen
• Provides excellent temperature distribution and homogeneity (≤ ± 1.5%)
• Programmable temperature profiles:
  • Heating rate: Up to 150 K/s, optionally 200 K/s.
  • Cooling rate: From T=1200 °C to 400 °C at 200 K/min, and from 400 °C to 100 °C at 30 K/min.