21 December 2024

The Nanovak Sputter/Thermal Combined System is a versatile high-vacuum deposition system used to create thin films or coatings on substrates in materials science and nanotechnology. The system includes an RF sputtering source, a DC sputtering source, and two thermal evaporation sources. RF/DC sputtering involves bombarding the target material with high-energy ions, causing atoms or molecules to be ejected and deposited onto a substrate. In thermal evaporation, materials are heated and vaporized, then condensed onto the substrate, allowing controlled deposition. This combination of sputtering and thermal evaporation capabilities makes the Nanovak system highly adaptable for various research and industrial applications, offering precise control over film thickness, composition, and uniformity.

Key Features:

• RF Magnetron Sputtering Source: 300W, 13.56 MHz power for high-precision sputtering.
• DC Magnetron Sputtering Source: 600V, 1.5kW power with digital current-limiting feature.
• Thermal Power Supply: 8VAC-500A/4000 Watt AC switched dual-channel thermal power supply.
• Vacuum Chamber: 40 cm x 40 cm x 50 cm vacuum chamber with a leak rate of 10-8 Torr·L/s.
• Sputtering Process: RF/DC sputtering can be performed with 1/2”, 1/4” and 1/8” targets.
• Pumping System: Comprises a mechanical pump (≥ 24 m3/h) and a molecular pump (400 L/s).
• Vacuum Level: The system can reach a vacuum level of 2×10-7 Torr when fully loaded.
• Precise Pressure Control: Stable growth with precise pressure control between 3-50 mTorr using a throttle valve and MFC (Mass Flow Controller) for gas flow.
• Gas Inlets: Three-channel gas inlet (Ar, N2, and O2) controlled by MFC.
• Film Thickness Control: Precise thickness adjustment with a measurement sensitivity of 0.1 Å/s.
• Substrate Temperature Control: Substrate temperature adjustable up to 500 °C with PID temperature control, maintaining ± 1 °C accuracy.
• Substrate Size: Substrates up to 100 mm (4″) in diameter can be coated.
• Rotary Speed: Samples can be rotated between 3-50 rpm, with Z-axis adjustments without disturbing the vacuum.
• Cooling System: 2000W water-cooling unit with PLC control.
• Multi-layer Deposition: Capable of preparing metal, oxide, and nitride films in consecutive layers.
• Integration: The system can be integrated with the Aixtron 200/4 RF-S MOCVD system.
• LabView Control: All system parameters can be controlled via computer using LabView software.

This system provides a comprehensive solution for producing high-quality thin films and is suitable for a wide range of material deposition applications.