7 December 2024

The Gold ball wire is used to make conductive leads for an integrated circuit chip or any other device that needs a connection with a wire. This allows power to be applied to a device structure and signals to be received.

Wire Characteristics:

• Ball bonding requires the primary bond to be a ball type bond and the secondary bond to be a capillary wedge bond. The bonding process requires the precise application of heat, ultrasonic energy, physical force and time to create a durable bond between the device and the substrate.
• Wire Diameter: 17 – 75 microns
• Wire Spool: TC-3, 2″, single flange
• Bonding Force: 10 to 160 grams
• Material: Gold

Performance:

• Loop Time: 900 ms
• Bonding Time: 10 to 100 ms
• Ultrasonic Power: 1.3 W (low), 2.0 W (high)
• Bonding Area: 3.75″ x 3.75″

Electrical Specifications:

• Voltage: 100/120/220/240 VAC
• Frequency: 50 – 60 Hz
• Power: Maximum 70 V