7 December 2024

The Gold Ball Wire Bonder is used to create conductive leads for integrated circuit chips or any other devices requiring connections, enabling power application to a device structure and the reception of signals.

Wire Characteristics:

• Ball Bonding: The first bond is a ball bond type, and the second bond is a capillary wedge bond. The bonding process requires precise application of heat, ultrasonic energy, physical force, and time to establish a strong connection between the device and the substrate.
• Wire Diameter: 17 – 75 microns
• Wire Spool: TC-3, 2″, single flange
• Bonding Force: 10 to 160 grams
• Material: Gold

Performance:

• Loop Time: 900 ms
• Bonding Time: 10 to 100 ms
• Ultrasonic Power: 1.3 W (low), 2.0 W (high)
• Bonding Area: 3.75″ x 3.75″

Electrical Specifications:

• Voltage: 100/120/220/240 VAC
• Frequency: 50 – 60 Hz
• Power: Maximum 70 V

This ball wire bonder is crucial for creating high-quality, reliable electrical connections for semiconductor devices, enabling accurate electrical characterization and device performance analysis.